Education:

• PhD Electrical Engineering: Stanford University 1996
• M.S. Electrical Engineering: Stanford University 1993
• B.S. Electrical Engineering: U.C. Berkeley 1992

• June '97 - present: IBM Almaden Research Center - Research Staff Member
• June '96 - June '97: Analog Devices Santa Clara - Design Engineer
• May '94 - June '95: Lucas NovaSensor - Engineering Intern
• May '92 - Sep '92: Almaden Research Center - Engineer
• May '91 - Aug '91: Almaden Research Center - Summer Intern

• Thermal AC to RMS Converter
• Vacuum Sensor
• Temperature Regulated Voltage Reference

E. H. Klaassen, Micromachined Instrumentation Systems, Ph.D. Dissertation , Stanford University, 1996.
 

E. H. Klaassen and G. T. A. Kovacs, "Integrated thermal-conductivity vacuum sensor," Sensors and Actuators A (Physical), vol. A58, no.1, pp. Inclusive Pagination: p. 37-42, 1997.

E. H. Klaassen, R. J. Reay, C. Storment, and G. T. A. Kovacs, "Micromachined thermally isolated circuits," Sensors and Actuators A (Physical), vol. A58, no.1, pp. Inclusive Pagination: p. 43-50, 1997.

E. H. Klaassen, R. J. Reay, and G. T. A. Kovacs, "Diode-based thermal r.m.s. converter with on-chip circuitry fabricated using CMOS technology [and post-process micromachining]," Sens. Actuators A, Phys. (Switzerland), Sensors and Actuators A (Physical), vol. A52, no.1-3, pp. Inclusive Pagination: p. 33-40, 1996.

E. H. Klaassen, K. Petersen, J. M. Noworolski, J. Logan, N. I. Maluf, J. Brown, C. Storment, W. McCulley, and G. T. A. Kovacs, "Silicon fusion bonding and deep reactive ion etching: a new technology for microstructures," Sens. Actuators A, Phys. (Switzerland), Sensors and Actuators A (Physical), vol. A52, no.1-3, pp. Inclusive Pagination: p. 132-9, 1996.

R. J. Reay, E. H. Klaassen, and G. T. A. Kovacs, "A micromachined low-power temperature-regulated bandgap voltage reference," IEEE Journal of Solid-State Circuits, vol. 30, no.12, pp. Inclusive Pagination: p. 1374-81, 1995.

E. H. Klaassen, R. J. Reay, and G. T. A. Kovacs, "Diode-based thermal RMS converter with on-chip circuitry fabricated using standard CMOS technology," 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Digest of Technical Papers (IEEE Cat. No.95TH8173), pp. Total Pagination: 3 vol. (934+1030+85) p. Inclusive Pagination: p. 154-7 vol.1, 1995.

E. H. Klaassen, K. Petersen, J. M. Noworolski, J. Logan, N. I. Maluf, J. Brown, C. Storment, W. McCulley, and G. T. A. Kovacs, "Silicon fusion bonding and deep reactive ion etching; a new technology for microstructures," 8th International Conference on Solid-State Sensors and Actuators and Eurosensors IX. Digest of Technical Papers (IEEE Cat. No.95TH8173), pp. Total Pagination: 3 vol. (934+1030+85) p. Inclusive Pagination: p. 556-9 vol.1, 1995.

R. J. Reay, E. H. Klaassen, and G. T. A. Kovacs, "Thermally and electrically isolated single crystal silicon structures in CMOS technology," IEEE Electron Device Letters, vol. 15, no.10, pp. Inclusive Pagination: p. 399-401, 1994.