David W. Burns
Consulting Assistant Professor

EDUCATION: 

• PhD, Materials Science, University of Wisconsin, Madison
• MS, Physics, University of Wisconsin, Madison
• MS, Materials Science, University of Wisconsin, Madison
• BS, Applied Math, Engineering and Physics, University of Wisconsin, Madison
• BS, Electronics Engineering Technology, DeVry Institute of Technology, Chicago

WORK EXPERIENCE:

• Consultant, MEMS Engineering and Device Development (2001-present) 
• Technical Director - Optical Micro-Machines, Inc. (2000-2001)
• Director of MEMS Technology - Maxim Integrated Products (1997-2000)
• Co-Founder and Chief Technology Officer - Intelligent MicroSensor Technology (IMST) acquired by Maxim (1997)
• Senior Principal Research Scientist - Honeywell Technology Center (1988-1997)
• Engineering Science Assistant - Sandia National Laboratories, Albuquerque, NM (1979-1980) 

RESEARCH INTERESTS: Micro-Electro-Mechanical Systems (MEMS) devices and processes in the optical, biomedical, RF, sensor, actuator and semiconductor fields

PUBLICATIONS:

• "Combining Light with Motion: Hybrid Integration of Light Emitters and Detectors with SOI-Based Micro-Opto-Electro-Mechanical (MOEMS) Systems,” SPIE Opto-Electronics 2001, Silicon-Based and Hybrid Optoelectronics, 1/23/01.
• "Distributed Micromachined Sensor Network,” SPIE Conference 3007, Silicon-Based Monolithic and Hybrid Optoelectronic Devices, San Jose, CA, 2/12/97-2/13/97.
• "Resonant Microbeam Sensors," Scientific Honeyweller , 1996.
• "Optically Driven Resonant Microbeam Temperature Sensors for Fiber Optic Networks," Technical Digest of the Solid-State Sensor and Actuator Workshop, Hilton Head Island, S. C., June 3-6, 1996.
• "Sealed-Cavity Resonant Microbeam Accelerometer," Sensors and Actuators A, Vol. 53 (1996), pp. 249-255.
• "Optically Excited Seof-Resonant Microbeams," Sensors and Actuators A, Vol. 52 (1996), pp. 92-98.
• "An Optical Network of Silicon Micromachined Sensors," SPIE Conference 2687, Miniaturized Systems with Micro-Optics and Micromechanics, San Jose, CA, 1/30/96-1/31/96.
• "Sealed Cavity Resonant Microbeam Accelerometer," Sensors Expo, Chicago, IL, 9/12/95.
• "Optically Excited Self-Resonant Microbeams," Sensors Expo, Chicago, IL, 9/12/95.
• "Sealed Cavity Resonant Microbeam Pressure Sensors," Sensors and Actuators A, Vol. 48 (1995), pp. 179-186.
• "Optically Excited Self-Resonant Strain Transducers," Transducers '95, International Conference on Solid-State Sensors and Actuators.
• "Resonant Microbeam Accelerometers," Transducers '95, International Conference on Solid-State Sensors and Actuators.
• "Optically Resonant Microbeams," SPIE proceedings, Vol. 2383A, Conference on Miniaturized Systems with Micro-optics and Micromechanics," Photonics West '95, San Jose, CA, Feb 10, 1995.
• "Resonant Microbeam Technology for Precision Pressure Transducer Applications, " Sensors Expo, Cleveland, OH, Sept 20-22, 1994.
• "A Digital Pressure Sensor Based on Resonant Microbeams," 1994 Solid-State Sensor and Actuator Workshop.
• "Resonant Integrated Micromachined (RIMS) Acoustic Sensor Development," SPIE Paper 2191-32, SPIE/SEM Smart Structures and Materials Conference: Smart Sensing, Processing, and Instrumentation, Orlando, FL., 2/15/94.
• "Resonant Integrated Microsensors," GOMAC '93.
• "Optical Drive/Sense for High Q Resonant Microbeams," Transducers '93, International Conference on Solid-State Sensors and Actuators.
• "Diagnostic Microstructures for the Measurement of Intrinsic Strain in Thin Films," Journal of Micromechanics and Microengineering, Volume 2 (1992), pp. 86-95.
• "Effective Bond Strength of Pyrex Thin-Film TE Bonds for Microstructure Applications," 1992 Solid-State Sensor and Actuator Workshop.
• "Polysilicon Resonant Microbeam Technology for High Performance Sensor Applications," 1992 Solid-State Sensor and Actuator Workshop.
• "Characteristics of Polysilicon Resonant Microbeams," Sensors and Actuators A (Physical), Vol. A35, No. 1, October 1992.
• "A Test Structure for Wafer-to-Wafer Bond Strength Measurement and Process Diagnostics," First International Conference on Semiconductor Wafer Bonding Science, Technology and Applications (1991).
• "Resonant Microbeam Strain Transducers," Transducers '91, International Conference on Solid-State Sensors and Actuators.
• "Microengineered Silicon Pressure Sensors," Electro International '91.
• "Environmentally Rugged, Wide Dynamic Range Microstructure Airflow Sensor," 1990 Solid-State Sensor and Actuator Workshop.
• "Thin Films for Micromechanical Sensors," Journal of Vacuum Science & Technology A, Vol. 8, No. 4, October 1989.
• "Micromechanics of Integrated Sensors and the Planar Processed Pressure Sensor," PhD Dissertation (1988), University of Wisconsin, Madison.
• "Polysilicon X-Ray Masks," Microelectronic Engineering, Vol. 9, No. 1-4, September 1988.
• "Processing Conditions for Polysilicon Films with Tensile Strain for Large Aspect Ratio Microstructures,” 1988 Solid-State Sensor and Actuator Workshop.
• "Mechanical Properties of Fine Grained Polysilicon—The Repeatability Issue,” 1988 Solid-State Sensor and Actuator Workshop.
• "Fine-Grained Polysilicon with Built-In Tensile Strain,” IEEE Transactions on Electron Devices, Vol. 35, No. 6, June 1988.
• "The Development of a Silicon Nitride Mask Technology for Synchrotron Radiation X-Ray Lithography," Nuclear Instruments & Methods in Physics Research, Vol. A266, No. 1-3, April 1987.
• "Measurement and Control of the Mechanical Properties of Thin Films,” Fourth International Conference on the Physics of Semiconductor Devices (1987).
• "Electromechanical Sensors—Results and Fabrication Procedures,” ISHM (1987).
• "A New Silicon Nitride Mask Technology for Synchrotron Radiation X-Ray Lithography: First Results,” Proceedings of the International Conference on Microlithography, Microcircuit Engineering (1987).
• "Fine-Grained Polysilicon and Its Application to Planar Pressure Transducers,” Transducers '87.
• "Use of Thin Films in Microsensor Construction," Journal of the Electrochemical Society, Vol. 133, No. 8 (1986).
• "Fabrication Techniques for Integrated Sensor Microstructures,” IEDM (1986).
• "Deposition Techniques and Properties of Strain Compensated LPCVD Silicon Nitride Films,” 1986 Solid-State Sensors and Actuators Workshop.
• "Design and Construction Techniques for Planar Polysilicon Pressure Transducers with Piezoresistive Readout,” 1986 Solid-State Sensors and Actuators Workshop.
• "A Technology for Integrated Transducers,” Transducers '85, International Conference on Solid-State Sensors and Actuators.
• "Integrated Transducers Based on Blackbody Radiation from Heated Polysilicon Filaments,” International Conference on Solid-State Sensors and Actuators (1985).
• "Laser-Recrystallized Piezoresistive Micro-Diaphragm Sensor,” International Conference on Solid-State Sensors and Actuators (1985).
• "A 1% Accuracy Medium Frequency and Quasi-Static CV Measurement and Analysis System for MOS Capacitor Parameter Extraction," Proceedings of the Sixth Biennial University/Government/Industry Microelectronics Symposium (1985).
• "A Simple Technique for the Determination of Mechanical Strain in Thin Films with Application to Polysilicon,” Journal of Applied Physics, Vol. 57, No. 5, March 1, 1985.
• "Planar Processed Polysilicon Sealed Cavities for Pressure Transducer Arrays,” 1984 International Electron Devices Meeting.
• "Micromechanical Structures Formed from Polysilicon," Short Talk, 1984 Solid-State Sensor and Actuator Workshop, Hilton Head Is., SC, June 6-8.

Patents

• US #6,255,728 “Rigid Encapsulation Package for Semiconductor Devices”, 7/3/01
• US #6,246,638 “Fiber-optic Vibration Sensor Based on Frequency Modulation of Light-excited Oscillators”, 6/12/01
• US #6,229,190 “Compensated Semiconductor Pressure Sensor”, 5/8/01
• US #6,147,397 “Stress Isolated Integrated Circuit and Method for Making” 11/14/00
• US #6,006,607 “Piezoresistive Pressure Sensor with Sculpted Diaphragm,” 12/28/99
• US #5,808,210 "Thin Film Resonant Microbeam Absolute Pressure Sensor," 9/15/98
• US #5,780,742 "Mechanical Resonance, Silicon Accelerometer," 7/14/98
• US #5,772,322 "Resonant Microbeam Temperature Sensor," 6/30/98
• US #5,747,705 "Method for Making a Thin Film Resonant Microbeam Absolute Pressure Sensor," 5/5/98
• US #5,714,690 "Piezoresistive Silicon Pressure Sensor Manufacture Implementing Long Diaphragms with Large Aspect Ratios," 2/13/98
• US #5,683,594 "Method for Making Diaphragm-Based Sensors and Apparatus Constructed Therewith," 11/4/97
• US #5,559,358 "Opto-Electro-Mechanical Device or Filter, Process for Making, and Sensors Made Therefrom," 9/24/96
• US #5,550,516 "Integrated Resonant Microbeam Sensor and Transistor Oscillator," 8/27/96
• US #5,511,427 "Cantilevered Microbeam Temperature Sensor," 4/30/96
• US #5,485,753 "Piezoresistive Silicon Pressure Sensor Implementing Long Diaphragms with Large Aspect Ratios," 1/23/96
• US #5,458,000 "Static Pressure Compensation of Resonant Integrated Microbeam Sensors," 10/17/95
• US #5,417,115 "Dielectrically Isolated Resonant Microsensors," 5/23/95
• US #5,295,395 "Diaphragm-Based Sensors," 3/22/94
• US #5,275,055 "Resonant Gauge with Microbeam Driven in Constant Electric Field," 1/4/94
• US #4,996,082 "Sealed Cavity Semiconductor Pressure Transducers and Method of Producing the Same," 2/26/91
• US #4,897,360 "Polysilicon Thin Film Process," 1/30/90
• US #4,853,669 "Sealed Cavity Semiconductor Pressure Transducers and Method of Producing the Same," 8/1/89
• US #4,744,863 "Sealed Cavity Semiconductor Pressure Transducers and Method of Producing the Same," 5/17/88
• US #4,658,279 "Sealed Cavity Pressure Sensors"

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